Advanced 3D IC Packaging

 
advanced 3D IC packaging

Advanced Technologies

Yasui Seiki has been at the forefront of supporting customers developing cutting-edge 3D IC packaging solutions for the semiconductor industry. Our active participation and innovative approaches are helping to shape the future of advanced semiconductor technologies.

Our Strengths

  1. Unparalleled coating uniformity with 1-2% tolerance
  2. Numerous patented coating technologies
  3. Extremely smooth and stable coating surface
  4. Highly customizable and versatile
  5. Ultra thin film and metal foil coating
  6. Durable and reliable Japanese workmanship
  7. Extensive know-how and coating expertise

80%

The Japanese multilayer ceramic capacitor (MLCC) manufacturer with over 80% of the world’s market share developed their technology using our slot die know-how, and they only use our technology to manufacture their product today.

Service Features

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Unparalleled coating uniformity with 1-2% tolerance
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Extremely smooth and stable coating surface
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Customizable and versatile
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Ultrathin film and metal foil coating
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Durable and reliable Japanese workmanship
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Extensive know-how and coating expertise